Fabrication

Rigid PCB

Rigid PCBs are widely used for their high reliability, durability, design flexibility, and suitability for high-density electronic applications.

Materials: FR4, CEM-3, Metal Core
Layer Count: 1 to 32 Layers
Board Thickness: 0.2 mm to 8 mm
Maximum Board Dimensions: 1500 × 610 mm
Maximum Copper Thickness: Inner – 5 oz / Outer – 10 oz
Minimum Line Width / Spacing: 2.5 mil / 2.5 mil
Aspect Ratio: 16:1
Surface Finishes: HASL, Lead-Free HASL, ENIG, Immersion Silver/Tin, OSP, Peelable Mask, Carbon Paste

Flexible PCBs

Flexible PCBs are manufactured using flexible materials, allowing them to bend, fold, and conform to different shapes. They are ideal for applications where space, weight, and flexibility are important.

Layer Count: 1 to 12 Layers
Board Thickness: 0.002" to 0.1"
Maximum Board Dimensions: 500 × 650 mm
Materials: PI, PET, PEN, FR4, DuPont
Final Copper Thickness: 1/3 oz to 2 oz
Impedance Control Tolerance: ±7%

Rigid-Flex PCBs

Rigid-Flex PCBs combine rigid and flexible PCB technologies, providing greater design flexibility while helping reduce overall board size, weight, and interconnection requirements.

Layer Count: 2 to 18 Layers
Board Thickness: 0.06 mm to 4.0 mm
Maximum Dimensions: 1092 × 660 mm
Final Copper Thickness: Inner – 12 oz / Outer – 12 oz
Minimum Line Width / Spacing: 3 mil / 3 mil
Impedance Control Tolerance: ±7%

Advanced PCB Fabrication Capabilities

Our fabrication capabilities include a wide range of advanced PCB processes to support complex and high-performance board requirements.

Blind & Buried Vias
Controlled Impedance
Gold Fingers
Half-Hole PTH
Press-Fit Drills
Edge Plating
Via Resin Filling
Peelable Solder Mask
Back Drilling

Laminate & Manufacturing Capabilities

Laminate Types: FR4 – Normal / High Tg / Halogen-Free, CEM-3, Metal Core, PTFE, PI
Laminate Brands: Nelco, ISOLA, Rogers, Shengyi, ITEQ, Panasonic, Taconic, ThinFlex, DuPont
Maximum Finishing Board Size: 1500 × 572 mm
Minimum Board Thickness: 0.2 mm
Maximum Board Thickness: 3.2 mm
Minimum Drill Size: 0.2 mm (Mechanical) / 0.1 mm (Laser)
Maximum Layer Count: 32 Layers
Maximum Copper Thickness: Inner – 5 oz / Outer – 10 oz
Minimum Trace Width / Spacing: 2.5 mil / 2.5 mil
Minimum BGA Pitch: 8 mil
Aspect Ratio: 16:1
Impedance Tolerance: ±8%
Surface Treatments: HASL, Lead-Free HASL, ENIG, Immersion Silver/Tin, Hard Gold, OSP, Bare Copper